Automatic ceramic substrate scribing machine Scriber｜Scribing/Attaching/Pick-and-Place Machine Scriber/Placer/Tray Setter｜FA Products

S125-ald / S230

A machine automatically splitting ceramic substrate. With an accuracy of ±30 μm, up to 230 x 230 mm in size can be supported.

Fine cracks generated by a diamond rotary cutter to divide the board after baking
With washing process not required, splitting after mounting parts possible.
Splitting with high accuracy possible without being affected by board contraction because machining is performed after baking.

Application examples	Sintered ceramic substrate

Max. work sheet size

X125mm x Y125mm

X230mm x Y230mm

Processing speed

500mm/s (100mm/s recommended)

Processing accuracy

±30μm

Dimensions

S125-ald

S230

Model		S125-ald	S230
Type		S125-ald-2	S230
Application examples		Sintered ceramic substrate
Machining target	Max. work sheet size	X125mm x Y125mm	X230mm x Y230mm
	Work sheet thickness	0.3～1.0mm
	Work sheet suction face	Entire bottom face
Processing capability	Accuracy ^*1	±30μm
Processing capability	Speed ^*1	500mm/s (100mm/s recommended)
Cutter	Type	Rotary diamond cutter
	Outline size	φ3.2 x 0.65(W)mm
	Tip angle	130°
	Pushing force	0.5～5kgf
Work sheet transfer	Loading / Unloading	Automatic	Manual
Image processing	Camera view	X4.8 x Y3.6mm (standard)
	Pattern detection	Pattern recognition via grayscale
	Illumination type	Transmission light, reflection light
Hardware	Interface	LAN,USB
Hardware	Display	17 inch LCD with touch panel
Software	OS	Windows7
Software	Production support function	Pushing pressure measurement (load cell)
Usage environment	Weight	Approx. 1,200kg	Approx. 1,000kg
	Power supply	1-phase, 180 to 240V AC, 50/60Hz, 3kVA
	Dry air	0.5MPa

+81-53-467-3601